穆德魁，博士，教授，博士生导师
工作经历：
2012年11月-2013年7月： 博士后研究员，昆士兰大学。
2013年8月至2014年6月： 研发工程师，斯培利亚（Nihon Superior Co.，Ltd, Osaka，Japan)
2014年9月至2015年8月： 讲师，江苏科技大学。
2015年10月至2020年12月：副教授，华侨大学。
2020年12月至今：教授（破格晋升），华侨大学。
发表论文：
1. Zhuo Liu, Wei Cheng, Qiaoli Lin, Dekui Mu*, Han Huang, Xipeng Xu: Growth mechanisms of interfacial carbides in solid-state reaction between single-crystal diamond and chromium, Journal of Materials Science and Technology, accepted. (SCI索引，中科院分区一区TOP)
2. Mian Li, Dekui Mu*, Shuiquan Huang, Hui Meng, Xipeng Xu, Han Huang: Ultrathin diamond blades for dicing single crystal SiC, Journal of Manufacturing Processes, 84(2022)88-99. (SCI索引，中科院分区二区)
3. Yueqin Wu, Qijian Rao, James P. Best, Dekui Mu，Xipeng Xu, Han Huang，Superior Room Temperature Compressive Plasticity of Submicron Beta‐Phase Gallium Oxide Single Crystals，Advanced Functional Materials，202207960. (SCI索引，中科院分区一区TOP)
4. Xinjiang Liao, Zhuo Liu, Ruixiang Liu, Dekui Mu*: Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy, Diamond and Related materials, 127(2022)109198. (SCI索引，中科院分区二区)
5. Wie Cheng, Zhuo Liu, Qiaoli Lin, Guoqing Huang, Dekui Mu*, Han Huang, Xipeng Xu: Towards Tailorable Interface Microstructure through Solid-state Interface Reaction between Synthetic Diamond Grits and Sputtered Ni-Cr Binary Alloy, Applied Surface Science, 596(4988)153531. (SCI索引，中科院分区一区TOP)
6. Ran Sui; Dekui Mu; Rui Cao, Jinghuan Chang: Kinetic Analysis of Wetting Behavior at High Temperatures, Advances in Colloid and Interface Science, 305 (2022) 102698. (SCI索引，中科院分区二区)
7. Han Huang, Xuliang Li, Dekui Mu, Brian R Lawn, Science and Art of ductile grinding of brittle solids, International Journal of Machine Tools and Manufacturing, 161(2021)103675. (SCI索引，中科院分区一区TOP)
8. Qiqi He, Yubin Zhang, Duan Nian, Hui Huang, Dekui Mu, Xinjiang Liao*, Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by Sn-Ti active solder, Powder Technology, 376 (2020) 643–651. (SCI索引，中科院分区二区TOP)
9. Yueqin Wu, Dekui Mu, Hang Huang, Deformation and removal of semiconductor and laser single crystals at extremely small scales, International Journal of Extreme Manufacturing 2(2020)012006. (SCI索引，中科院分区一区)
10. Zhuo Liu, Xinjiang Liao, Wei Fu, Dekui Mu*, Xipeng Xu, Han Huang: Microstructures and Bonding Strength of Synthetic Diamond Brazed by Near-Eutectic Ag-Cu-In-Ti Filler Alloy, Materials Science & Engineering A, 790 (2020) 139711. (SCI索引，中科院分区一区TOP)
11. Yubin, Zhang, Xinjiang Liao, Qiaoli Lin, Dekui Mu*, Jing Lu, Hui Huang, Han Huang: Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials 13 (2020) 1532. (SCI索引，中科院分区三区)
12. Xinjiang Liao, Qiqi He, Qiaoli Lin, Dekui Mu*: Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond, Applied Surface Science 504 (2020) 144508. (SCI索引，中科院分区一区TOP)
13. D. Mu*, K.Y. Feng, Q.L. Lin, H. Huang: Low-temperature wetting of sapphire using Sn–Ti active solder alloys, Ceramics International, 45 (2019) 22175–22182. (SCI索引，中科院分区二区TOP)
14. X.J. Liao, D. Mu*, W. Fu, H. Huang, H. Huang: Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Materials & Design, 182 (2019) 108039. (SCI索引，中科院分区一区TOP)
15. M Li, J Chen, Q Lin, Y Wu, D Mu*: Interfacial microstructures and mechanical integrity of synthetic diamond brazed by a low-temperature Cu-Sn-Cr filler alloy, Diamond and Related Materials, 97 (2019) 107440. (SCI索引，中科院分区二区)
16. J. Chen, X. Liao, Q. Lin, D. Mu*, H. Huang, X. Xu. H. Huang: Reactive wetting of binary Sn Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diamond and Related Materials, 92 (2019) 92-99. (SCI索引，中科院分区二区)
17. J. Chen, D. Mu*, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy. International Journal of Refractory Metals and Hard Materials, 74 (2018) 52-60. (SCI索引，中科院分区二区)
18. X. Liao, D. Mu*, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, International. Journal of Refractory Metals & Hard Materials, 66 (2017) 252-257. (SCI索引，中科院分区二区)
19. D.Mu, S.D. McDonald, J. Read, H. Huang and K. Nogta: Critical Properties of Cu6Sn5 in Electronic Devices: Recent Progress and A Review. Current Opinion in Solid State & Materials Science. 20, (2016) 55-76. (IF: 11.3) (SCI索引，中科院分区二区)
20. Y.F. Yang, D. Mu: Simultaneous dehydrogenation and synthesis of TiB2-TiC through self-propagation high-temperature synthesis from TiH2-B4C powder blends, Metallurgical and Materials Transactions A.
21. Y. F. Yang, D. Mu: Effects of Ni additions on the formation of Ti5Si3 prepared by self-propagation high-temperature synthesis. Journal of the European Ceramic Society.
22. Y. F. Yang, D. Mu: Dehydrogenation process and its effect on formation mechanism of TiC during self-propagation high-temperature synthesis from TiH2-C. Powder Technology.
23. Y.F. Yang, D. Mu, Q.C. Jiang: A simple route to fabricate TiC-TiB2/Ni composite via thermal explosion reaction assisted with external pressure in air. Materials Chemistry and Physics.
24. D. Mu, H. Huang, S. D. McDonald, J. Read and K. Nogita: Investigating the Mechanical Properties, Creep and Crack Pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on Diverse Crystal Planes. Material Science and Engineering A, 566, 126 (2013).
25. D. Mu, H. Huang, S. D. McDonald and K. Nogita: Creep and Mechanical Properties of Cu6Sn5 and (Cu,Ni)6Sn5 at Elevated Temperatures. Journal of Electronic Materials, 42, 304 (2013).
26. D. Mu*, H. Yasuda, H. Huang and K. Nogita: Growth orientation and mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5 on poly-crystalline Cu. Journal of Alloys and Compounds, 536, 39 (2012).
27. D. Mu, H. Huang and K. Nogita: Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5. Materials Letters, 86, 46 (2012).
28. K. Nogita, D. Mu, S. D. McDonald, J. Read and Y.Q. Wu: Effect of Ni on phase stability and thermal expansion of Cu6-XNiXSn5. Intermetallics, 26, 78 (2012).
29. D. Mu*, J. Read, Y. F. Yang and K. Nogita: Thermal expansion of Cu6Sn5 and (Cu,Ni)6Sn5. Journal of Material Research, 26, 2660 (2011).
30. D. Mu*, H. Tsukamoto, H. Huang and K. Nogita: Formation and mechanical properties of intermetallic compounds in Sn-Cu high-temperature lead-free solder joints. Material Science Forum, Vol. 654, 2450 (2010).
主持或参与的科研项目：
1. Lap Shear Joint Testing，GM中国，主持，在研。
2. 福建省中央引导地方科技发展项目：晶圆级封装芯片切割用金刚石超薄砂轮制备与评价关键技术研究，主持，100万，在研。
3. 先进结构与复合材料国家重点研发计划：磨削类超硬材料制品增材制造工艺及应用示范，参与（第八），300万，在研。
4. 国家自然科学基金联合基金重点项目: 复杂形状石材制品省材高效加工关键技术基础研究，参与（第四），在研。
5. 国家自然科学基金面上项目：活性软钎料低温连接金刚石磨粒关键技术的基础研究，主持，结题。
6. 福建省科技厅引导性项目：钎焊金刚石用异质增强低温焊料的开发研究，主持，结题。
7. 厦门市科技局产学研协同创新项目：钎焊微粉金刚石砂轮制备工艺，主持，结题。
8. 华侨大学中青年教师科技创新资助计划(优秀青年科技创新人才)（2018-2022），主持，结题。
获奖情况：
1. 2021、2022年度福建省大学生互联网加创新创业大赛金奖、华侨大学大学生创业优秀导师
2. 2021年福建省技术发明一等奖（第四）
3. 2019年福建省优秀硕士论文（指导教师）
4. QUT Postgraduate Research Award (QUTPRA)
5. Australian Postgraduate Award (APA) with top-up from Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) and UQ Graduate School International Travel Award (GSITA)
6. The Best Published Material Award (UQ Postgraduate Engineering Conference 2012)
联系方式： dekui.mu@hqu.edu.cn
制造工程研究院主页：http://ime.hqu.edu.cn
